

POWERING THE FUTURE
Advanced micro device solutions
for the next generation of technology
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250+
Years Experience

50+
Experts

14
Patents Issued
Leading Innovation in Micro Devices
We are an emerging leader in high-performance computing (HPC), package-integrated, power delivery solutions for artificial intelligence (AI) and advanced networking devices. We use our expertise and forward thinking to enable a new paradigm in power delivery network design that will allow these and other emerging applications to realize their full potential.
Our Technology
Empowering Tomorrow’s Technology
Artificial intelligence (AI) is taking the world by storm, driving massive investments in data center expansion. However, current power delivery network technology has reached its limit, restricting performance even though the processors and accelerator engines that power these data centers are fabricated using the most advanced microarchitectures and manufacturing process nodes. Faced with rising core counts, reduced operating voltages, higher current flows and adoption of chiplet-based architectures, power delivery network designers are being dually challenged by increased power density and reduced availability of passive-component real estate.
Innovation in Action
Discover how our technology is transforming industries worldwide
Our Technologies
Innovative solutions powered by cutting-edge research and development
STILE Embedded Power Delivery Modules
The Saras Tile, or STILE™, offers a new paradigm for in-package power delivery that significantly improves efficiency and performance while freeing up package real estate to enable higher levels of chiplet integration. A multi-domain, substrate-embedded, passive module, STILE™ is designed to support the growing number of power rails within the package. STILE™ enables the move of power regulation from system board to package.
Markets We Serve
Delivering excellence across diverse industries worldwide
- High-speed computing
- Thermal optimization
- Low power consumption
- AI acceleration

Advanced Computing
Because tomorrow’s semiconductor devices need more useable power to achieve their full computing potential. The market is in need of greater efficiency in power management and usage.
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AI & Machine Learning
Rapid development is driving the scale-up of computing and networking infrastructure, rapid development and deployment of artificial intelligence (AI) and machine learning (ML) and distributed computing.
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Data Centers
We are witnessing an explosion in data-intensive applications. Networking traffic to support mobile applications continually increases exponentially, cloud and big data have moved into zettabyte territory, internet of things is rapidly approaching 50 billion connected devices, and autonomous driving is just around the corner. The transfer and storage of massive amounts of data continues to be in high demand.
Learn MoreSaras is providing solutions to these market challenges. Working to ensure that power delivery no longer inhibits progress. We deliver greater performance from every watt, not just propelling our industry forward but also defining a new class of power delivery that the new AI era demands.
Latest News
Stay updated with our latest innovations and company announcements

December 23, 2025
Viewpoint 2026: Powering AI with a New Class of Power Delivery
By Eelco Bergman, Chief Business Officer, Saras Micro Devices Throughout 2025, the limits of traditional power-delivery architectures for high-performance computing devices became too significant to ignore. Artificial intelligence (AI) accelerators pushed into kilowatt-class devices, advanced packaging raised silicon and power densities, and board-centric architectures struggled to keep pace with long-term AI compute performance growth. From […]


News & Releases · July 22, 2026
Saras Micro Devices Strengthens Senior Leadership Team to Scale Advanced Packaging Technology and Customer Growth
Press Articles · August 22, 2025
How the semiconductor boom and ASU are transforming Arizona’s economy
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