Pioneering
the next paradigm in power efficiency
Unleashing Heterogenous Integration
Saras Micro Devices is defining the next paradigm in power efficiency to meet increasing demands of advanced computing. Delivering innovative design and manufacturing solutions, Saras products will eliminate the power management challenges faced by large AI/HPC computing engines with cost-effective new panel-level power delivery technology.
THE PROBLEM
The future of computing power is constrained by power efficiency
With data creation exploding and next-generation technologies on the horizon, the need for innovative power delivery solutions has never been greater for innovation.
- High performance computing
- Cloud, hyperscale & virtualization
- Machine intelligence
- Big data analytics
- AI training & inferencing
- Immersive & instinctive computing
- Software-defined storage
THE SOLUTION
Saras alPD™ = Aluminum Integrated Passive Devices (Initial product line)
CURRENT STATE
State of art
Hundreds of Passives
Power & thermal constrained
COMING SOON
with SARAS micro devices
One alPD™
Power & thermal efficiency reduced footprint
3D Power Delivery Fabric™
(substrate embedding not shown for clarity)
FUTURE STATE
with SARAS micro devices
One alPD™
Design freedom enabled
3D Power Delivery Fabric™
(substrate embedding not shown for clarity)
BREAKTHROUGH PERFORMANCE
SARAS is working to eliminate the
power challenges of large HPC computing engines, AI, virtual reality, 5G and more with new panel-level power delivery technology
Our heterogeneous integration solutions deliver substantially improved HPC performance per Watt, reduced design cycle times and reduced 3D footprint through seamless co-design — all at a cost advantage.
Advantages
- 2X power efficiency
- Flexible design options
- Lego-block approach
- Double-sided connections standard
- Chip passive co-design
- Group plane design available
- Customizable IO
- Low profile
