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Pioneering

the next paradigm in power efficiency

Unleashing Heterogenous Integration

Saras Micro Devices is defining the next paradigm in power efficiency to meet increasing demands of advanced computing. Delivering innovative design and manufacturing solutions, Saras products will eliminate the power management challenges faced by large AI/HPC computing engines with cost-effective new panel-level power delivery technology.

THE PROBLEM

The future of computing power is constrained by power efficiency

With data creation exploding and next-generation technologies on the horizon, the need for innovative power delivery solutions has never been greater for innovation.

THE SOLUTION

Saras alPD™ = Aluminum Integrated Passive Devices (Initial product line)

CURRENT STATE

State of art

Hundreds of Passives

Power & thermal constrained

fabric-01
COMING SOON

with SARAS micro devices

One alPD™

Power & thermal efficiency reduced footprint

3D Power Delivery Fabric™

(substrate embedding not shown for clarity)

FUTURE STATE

with SARAS micro devices

One alPD™

Design freedom enabled

3D Power Delivery Fabric™

(substrate embedding not shown for clarity)

BREAKTHROUGH PERFORMANCE

SARAS is working to eliminate the
power challenges of large HPC computing engines, AI, virtual reality, 5G and more with new panel-level power delivery technology

Our heterogeneous integration solutions deliver substantially improved HPC performance per Watt, reduced design cycle times and reduced 3D footprint through seamless co-design — all at a cost advantage.

Advantages

  • 2X power efficiency
  • Flexible design options
  • Lego-block approach
  • Double-sided connections standard
  • Chip passive co-design
  • Group plane design available
  • Customizable IO
  • Low profile
delivery-fabric-graphic