EXECUTIVE TEAM
Richard Sheridan
Vice President of Engineering
Richard Sheridan, VP of Engineering, has 30+ years of semiconductor packaging industry experience. Working for such notable companies as Park Electrochemical (NELCO), Amkor Technologies, STATS ChipPAC, and most recently Unimicron Technology Corp. Mr. Sheridan’s major areas of focus have included substrate process engineering, advanced substrate development, packaging R&D, system-in-package development, embedded solutions for Si photonics substrates, and general business development activities. He graduated from Arizona State University with a BS in Mathematics.
