Urmi Ray is an experienced semiconductor professional with over 25 years of experience working with industry organizations such as iNEMI, IMAPS, SEMI and others on driving advanced packaging and integration strategies. She has worked at JCET Group focusing on advanced system in package (SIP) technologies and Qualcomm as the technology and program lead in several forward-looking programs in 3D and 2.5D and system integration, with particular focus on low-cost packaging for mobile industry. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in NJ working on advanced materials and reliability for a diverse set of product portfolios, including consumer products and high reliability telecommunications projects. She has a PhD from Columbia University (New York City).
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